News & Events

Mar 26, 2010

INTERMOLD 2010

INTERMOLD 2010

Nano Soft Co., Ltd & Yoshikawa Maple Co., Ltd to showcase IMOLD for SolidWorks at the 21st Japan International Die & Mold Technology Exhibition

Venue: INTEX, Osaka, Japan

Date: 14-17 April 2010

 

www.imold.jp

www.nano-soft.co.jp

www.ymp.co.jp

Manusoft Press

Latest News